Beng: Rumor Mill: 7mm-thick Galaxy SIII coming in May?

মঙ্গলবার, ৭ ফেব্রুয়ারী, ২০১২

Rumor Mill: 7mm-thick Galaxy SIII coming in May?

Korea's ETNews is betting its reputation upon this raft of rumored details concerning Samsung's Galaxy SIII. Since the only thing we know for certain is that it'll be announced "After MWC," lets take all of these tidbits with a strong pot of "We'll believe it when we see it," okay? According to the report, the handset's going to be 7mm thick, helped by the company shrinking down its PCB, connector and chip sizes by between 10 and 20 percent. The only thing that hasn't lost any weight is the camera, which may sit on a "protrusion" (like the Droid RAZR's hump). It'll be running a custom quad-core processor with HDMI and LTE baked-in, and rather obviously it'll be running Ice Cream Sandwich. Here's where things get a little confusing, either this is the first of a raft of models that will highlight different features (so we'll see subsequent GSIIIs with an S-Pen, 3D display or souped-up camera) or the above perks will come with the flagship as standard. Parts are reportedly gearing up to be shipped, but the only time we'll get confirmation is when that special event kicks off closer to the summer.

[Thanks, Erich]

Rumor Mill: 7mm-thick Galaxy SIII coming in May? originally appeared on Engadget on Mon, 06 Feb 2012 11:31:00 EDT. Please see our terms for use of feeds.

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